- Primerless potting. Dow SYLGARD 567 Primerless Silicone Encapsulant Black is a two-component material used in potting applications for automotive assemblies, power supplies, high-voltage resistor packs, LED lighting, industrial controls, and connectors. It offers unprimed adhesion, heat curing, flowability, minimal shrinkage, low viscosity, and good dielectric properties. This kit is a Dow product repackaged by KitPackers.
- Self-priming benefit. Because SYLGARD 567 is primerless, it bonds to many substrates with only good cleaning rather than a separate primer step, which can simplify the process and reduce the number of materials and operations on the line. Its low viscosity and flowability help it fill around components during potting.
- Cured performance. The cured encapsulant provides good dielectric properties for electrical insulation and exhibits minimal shrinkage, helping preserve dimensional accuracy and reduce stress on delicate parts. Distributor data also notes flame resistance for the SYLGARD 567 family, supporting use in demanding electronics.
- Handling notes. As a two-part material, it must be mixed before curing; the mixer is not included with this kit. Review the product and Safety Data Sheets and confirm the cure schedule for your application before production use.
Recommended For
- Potting automotive assemblies
- Power supplies and high-voltage resistor packs
- LED lighting and connectors
- Industrial controls
- Applications needing primerless adhesion
Product Details
- Product type: Two-part primerless silicone encapsulant
- Color: Black
- Cure: Heat curing
- Key properties: Unprimed adhesion, flowability, minimal shrinkage, low viscosity, good dielectric properties
- Packaging: Repackaged by KitPackers; 200 mL kit (mixer not included)
Primary Industries
- Automotive electronics
- Power supply manufacturing
- LED lighting manufacturing
- Industrial controls and electronics
Standards and Certifications
- None specified by source



