Dow SYLGARD 184 Silicone Encapsulant Curing Agent Clear 20.4 kg Pail - 184 CURING AGENT 20.4KG PL

Description

SYLGARD™ 184 Silicone Curing Agent is the curing component of a two-component, flowable silicone system. It is designed to be used with the SYLGARD 184 base to produce a flexible encapsulant for electrical and electronic applications.
The material offers good dielectric properties and flame resistance and can be cured at room temperature or with heat. Typical uses include LED lighting, power supplies, connectors, sensors, industrial controls, transformers, amplifiers, high-voltage resistor packs, relays, solar cells, and beam lead integrated circuits.
This version is supplied as a clear curing agent packaged in a 20.4 kg pail. The product is in stock and usually ships in 1–2 business days.

Key Features

• Curing agent for SYLGARD 184 system

• Two-component silicone encapsulant system

• Room temperature and heat-cure capability

• Good dielectric properties

• Flame resistant

• Clear formulation

Applications

• LED lighting

• Power supplies

• Connectors

• Sensors

• Industrial controls

• Transformers

• Amplifiers

• High-voltage resistor packs

• Relays

• Solar cells

• Beam lead integrated circuits

Benefits

• Supports flexible silicone encapsulation

• Provides reliable dielectric performance

• Offers flame-resistant properties

• Suitable for a wide range of electronic and electrical assemblies

Product Specs

Brand	SYLGARD
Chemical Composition	Silicone
Color	Clear
Components	2 part
Cure System	Room Temperature / Heat
Cure Time	48 h @ 25 °C 35 min @ 100 °C 20 min @ 125 °C 10 min @ 150 °C
Dielectric Strength	19 kV/mm
Flash Point	>101.1 °C
Mix Ratio	10:1
Service Temperature	-45 to 200 °C
Specific Gravity	1.03
Tensile Strength	980 psi
Thermal Conductivity	0.27 W/mK
Viscosity (Mixed)	3500
Volume Resistivity	2.9 × 10¹⁴ ohm-cm
Working Time	1.5 h @ 25 °C

Categories

• Encapsulants

• Silicone Materials

• Dow Products

• Electronic Assembly Materials