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  • Dow DOWSIL SE 1700 W/C Thermally Conductive Adhesive Clear 1.1 kg Kit - SE 1700 CLEAR W/C 1.1KG KT
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Dow DOWSIL SE 1700 W/C Thermally Conductive Adhesive Clear 1.1 kg Kit - SE 1700 CLEAR W/C 1.1KG KT

$210.02
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SKU: SE 1700 CLEAR W/C 1.1KG KT
California prop 65
Description
  • High-strength sealing adhesive. Dow DOWSIL SE 1700 W/C Thermally Conductive Adhesive Clear is a two-part, non-flowing, heat-cure adhesive with high tensile strength. It is primarily used for sealing ceramic condensers, sealing PCB components, and as a bonding agent for the key pad of a PC.
  • Non-flowing behavior. Because SE 1700 is non-flowing, it holds its shape after dispensing rather than slumping, which is useful for sealing and bonding on vertical or intricate surfaces and for maintaining a defined bead. Its high tensile strength gives durable bonds in the finished assembly.
  • Cure and processing. SE 1700 is a heat-cure system, so the mixed two-part material is cured by applying heat. This provides controlled, on-demand curing suited to production lines. The 1.1 kg kit supplies both components for mixing before use.
  • Handling notes. As a two-part material, the components must be combined per the manufacturer's instructions before curing. Review the product and Safety Data Sheets, and confirm the recommended mix and cure schedule for your specific application before production use.

Recommended For

  • Sealing ceramic condensers
  • Sealing PCB components
  • Bonding PC key pads
  • Applications needing a non-flowing, high-strength bond
  • Electronics sealing and bonding

Product Details

  • Product type: Two-part heat-cure silicone adhesive
  • Color: Clear
  • Consistency: Non-flowing
  • Cure: Heat cure
  • Key property: High tensile strength
  • Container size: 1.1 kg kit

Primary Industries

  • Electronics and PCB manufacturing
  • Component sealing
  • Consumer electronics assembly
  • Industrial electronics

Standards and Certifications

  • None specified by source
Reviews

FAQs

What is DOWSIL SE 1700 used for?

It is a two-part, heat-cure silicone adhesive with high tensile strength, used primarily for sealing ceramic condensers, sealing PCB components, and bonding the key pad of a PC. Its non-flowing consistency and strong bonds suit precise electronics sealing and bonding tasks.

What does 'non-flowing' mean for this adhesive?

Non-flowing means the dispensed material holds its shape rather than slumping or running, even on vertical or intricate surfaces. This helps maintain a defined bead where it is placed, which is valuable for controlled sealing and bonding on electronic components and assemblies.

How is SE 1700 cured?

SE 1700 is a heat-cure, two-part system, so the mixed material is cured by applying heat rather than at room temperature. Heat cure gives controlled, on-demand processing suited to production. Consult the technical data sheet for the recommended mix ratio and cure schedule for your components.

Why is high tensile strength important here?

High tensile strength means the cured adhesive resists being pulled apart, giving durable, reliable bonds in the finished assembly. For sealing condensers and bonding components, that strength helps the joint withstand handling and service stresses over the life of the device.

Does SE 1700 come as one part or two?

It is a two-part material supplied as a 1.1 kg kit, so the two components must be combined per the manufacturer's instructions before heat curing. Follow the recommended mixing and cure procedure, and review the Safety Data Sheet before handling and production use.