Dow DOWSIL 3-6752 Thermally Conductive Adhesive Gray 30 cc Syringe - 3-6752 TC ADHESIVE 75G

Description

• Key Performance Benefit: One component, heat curing silicone adhesive designed to cool electronic applications while providing strong bonding to metals, ceramics, filled plastics, epoxy laminates, and organic substrates.
• Material & Construction: One-part silicone formulation; heat curing; gray color; self-leveling, flowable, thixotropic; contains no added solvents; specific gravity 2.6 @ 25 °C; viscosity 81,000.
• Risk Reduction/Compliance Benefit: Flame resistant formulation; no added solvents; designed for bonding applications requiring flexibility and thermal conductivity.
• Protection Level: Thermal conductivity 1.8 W/mK; dielectric strength 400 V/mil; service temperature range -45 to 200 °C; flash point >100 °C.
• Comfort & Usability: Supplied in 30 cc syringe; cure time 40 min @ 100 °C, 10 min @ 125 °C, 3 min @ 150 °C; self-leveling and flowable consistency; thixotropic properties support controlled application.
• Safety & Compliance Assurance: Brand: DOWSIL; hardness 87 A; elongation 15%; tensile strength 545 psi; shear strength 540.

Recommended For

• Bonding hybrid circuit substrates
• Bonding power semiconductor components
• Attaching devices to heat sinks
• Electronic cooling applications
• Bonding metals and ceramics
• Applications requiring flexibility and thermal conductivity

Product Details

• Brand: DOWSIL
• Product Type: Thermally Conductive Adhesive
• Color: Gray
• Components: 1 Part
• Packaging: 30 cc Syringe
• Cure Time: 40 min @ 100 °C; 10 min @ 125 °C; 3 min @ 150 °C
• Thermal Conductivity: 1.8 W/mK
• Dielectric Strength: 400 V/mil
• Service Temperature: -45 to 200 °C
• Hardness: 87 A
• Elongation: 15%
• Tensile Strength: 545 psi
• Shear Strength: 540
• Specific Gravity: 2.6 @ 25 °C
• Flash Point: >100 °C
• Viscosity: 81,000

Primary Industries

• Electronics Manufacturing
• Semiconductor
• Electronic Assembly

Standards and Certifications

• Flame Resistant
• No Added Solvents