Chemtronics Soder-Wick Rosi

Chemtronics Soder-Wick Rosi - 80-3-10

$10.24

Key Performance Benefit: State-of-the-art desoldering braid designed for heat-sensitive electronic components, offering fast response and improved thermal conductivity to minimize overheating and prevent PCB damage.
Material & Construction: Lighter mass pure copper braid construction; noncorrosive ultra high purity Type R rosin flux; sealed in nitrogen-purged packaging to prevent corrosion and moisture-related performance loss; packaged in ESD-safe static dissipative bobbins; available in 5' and 10' spools.
Risk Reduction/Compliance Benefit: Minimizes risk of heat damage to boards; reduces risk of static electricity damage; will not leave ionic contamination; nitrogen-purged packaging protects against corrosion and moisture exposure.
Protection Level: Complies with MIL-F-14256 F Type R flux; NASA-STD-8739.3 Soldered Electrical Connections; DOD-STD-883E Method 2022; ANSI/IPC J STD-004 Type ROL0.
Comfort & Usability: Responds faster than conventional desoldering braids; BGA braid sized for BGA pad and chip rework/repair; cleans entire BGA pads in three to four passes; packaged in ESD-safe static dissipative bobbins; 12 cans per case.
Safety & Compliance Assurance: Meets MIL-F-14256 F; NASA-STD-8739.3; DOD-STD-883E Method 2022; ANSI/IPC J STD-004 Type ROL0; designed for PCB repair and prototyping applications.